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| IA NT Features 0 DEA 24Q Lead free RoHS compliant* Supports 15 KV IEC 61000-4-2 ESD equipment specification* Single device protects as many as 20 lines on exposed pins, communications ports oH S CO M PL Incorporates 40 bi-directional PN junction diodes Small form factor replaces 20 SOT23 packages *R 02 General Information The Model 2DEA Series is well-suited for space constrained designs where the requirements of international ESD standard specification IEC 61000-4-2 must be met. These highly integrated PN junction diode arrays are especially effective for use in PC notebooks and motherboards, engineering workstations and portable battery-powered devices such as PDAs and cellular phones. Space savings, as compared to popular BA V99 SOT23 based implementations, can yield a 75 % reduction in utilized board area. In addition, significant assembly cost reductions and manufacturing integrity improvements can be realized. Two package options are available. Model 2DEA consists of 20 bi-directional diode pairs in a miniature 24-pin JEDEC QSOP package. The 2DEB consists of 17 bi-directional diode pairs in a traditional wide-body SOIC JEDEC package. Electrical & Environmental Characteristics Electrical Characteristics Supply Voltage Voltage @ any Channel Channel Clamp Current (continuous) Forward Voltage: @If = 1 mA @If = 12 mA Leakage Current @ VSS Operating Temperature Storage Temperature Diode Power Rating ESD Performance Withstand*: Contact Discharge Air Discharge TJ Tstg -55 -65 20 8 15 9 16 +125 +150 C C mW/diode kV kV * Note: IEC 61000-4-2 ESD test performance is measured at the systems level and system designs, enclosure shielding and other conventional ESD control measures usually influence the results of these tests. Testing on the component level serves as an indicator that the system passes a specific compliance step, but does not ensure that the system passes at that level. The Model 2DEA/DEB device, therefore, can support successful implementation of the IEC 61000-4-2 system level ESD standard. *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 6 003 Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array Package Schematic VDD 24 23 22 21 20 VSS 19 18 17 16 15 14 13 1 2 3 4 5 67 VSS 8 9 10 11 12 VDD Symbol VDD - VSS Vin IC Vf Minimum -0.3 -0.3 Nominal Maximum 12 VDD + 0.5 15 Unit V V mA V V A pF 0.8 0.1 0.9 1.5 10 5 Applications Parallel printer ports, communication ports Hot-swappable designs IC protection Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array Mechanical Characteristics QSOP Package Dimensions A .635 TYP. (.025) 3.81 - 3.99 (.150 - .157) Wide-Body SOIC Package Dimensions 12.66 - 12.86 (.496 - .505) 1.27 TYP. (0.50) 0.66 (.026) REF 7.40 - 7.60 (.291 - .299) PIN 1 0.38 - 0.48 (.014 - .016) 2.44 - 2.64 (.096 - .104) PIN 1 .21 - .31 (.008 - .012) 1.35 - 1.75 (.053 - .069) 0.10 - 0.30 (.004 - .012) .10 - .25 (.004 - .010) 0.23 - 0.32 (.0091 - .0125) 0-8 .19 - .25 (.007 - .010) 0-8 10.11 - 10.51 (.398 - .414) 5.80 - 6.20 (.228 - .244) .41 - 1.27 (.016 - .050) Governing dimensions are in mm. Dimensions in parentheses are in inches and are approximate. JEDEC Reference Number MS-013. Model 2QSP24 A 8.56 - 8.74 (.337 - .344) Governing dimensions are in mm. Dimensions in parentheses are in inches and are approximate. JEDEC Reference Number MO-137. QSOP Package Power Temperature Derating Curve 1.25 WATTS 1.0 .75 .50 .25 0 25 50 75 100 125 150 AMBIENT TEMPERATURE ( C ) 2QSP24 Wide-Body SOIC Package Power Temperature Derating Curve 1.25 WATTS 1.0 .75 .50 .25 0 25 50 75 100 125 150 AMBIENT TEMPERATURE ( C ) WBSOIC20 Standard Part Numbers Part Number (Tape & Reel) 2DEA-2-Q24R 2DEB-2-W20R Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Part Number (Tubes) 2DEA-2-Q24T 2DEB-2-W20T Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array Dispensing For large quantities, the product will be dispensed in Tape and Reel (see diagram below). A0 DIMENSIONS = MM (INCHES) B0 K0 Package QSOP 24 Pin WBSOIC 20 Pin How To Order A0 6.5 (0.256) 13 (0.519) B0 9.0 (0.354) 10.8 (0.425) K0 2.1 (0.083) 2.8 (0.110) Width 16 (0.630) 24 (0.945) Pitch 8 (0.315) 8 (0.315) No. of Pieces No. of Pieces per 13 reel per tube 3,500 3,500 56 37 2 DEA - 2 - Q 24 R LF Product Class Thin-Film-on-Silicon Product Function ESD Protection Diode Array DEA = 20 Lines DEB = 17 Lines Standard Standard Package Style Q= QSOP W = Wide-Body SOIC Pin Count Q = 24 W = 20 Dispensing R = Reel T = Tube Terminations LF = 100 % Sn (lead free) Typical Part Marking Represents total content. Layout may vary. PRODUCT FUNCTION PIN COUNT PIN 1 INDICATOR (MOLDED INDENT) MANUFACTURER'S TRADEMARK DEA002 24Q YYWW PACKAGE STYLE Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 * Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com DATE CODE 04/07 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. |
Price & Availability of 2QSP24
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